Intel Pentium G3250 3.2 GHz Dual-Core CPU Processor 3M 53W LGA 1150

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General information Type Market segment Desktop Family Model number CPU part numbers CM8064601482514 is an OEM/tray microprocessor CM8064601562019 is an OEM/tray microprocessor BX80646G3250 is a boxed processor with fan and heatsink (English version) BXC80646G3250 is a boxed processor with fan and heatsink (Chinese version) Frequency 3200 MHz Bus speed 5 GT/s DMI Clock multiplier 32 Package 1150-land Flip-Chip Land Grid Array Socket Size 1.48" x 1.48" / 3.75cm x 3.75cm Introduction date Price at introduction $64 S-spec numbers Part number ES/QS processors Production processors BX80646G3250 + + BXC80646G3250 + + CM8064601482514 + CM8064601562019 + Unknown + Architecture / Microarchitecture Microarchitecture Haswell Processor core Core stepping C0 (SR1K7) Manufacturing process 0.022 micron Data width 64 bit The number of CPU cores 2 The number of threads 2 Floating Point Unit Integrated Level 1 cache size 2 x 32 KB 8-way set associative instruction caches

2 x 32 KB 8-way set associative data caches Level 2 cache size 2 x 256 KB 8-way set associative caches Level 3 cache size 3 MB 12-way set associative shared cache Physical memory 32 GB Multiprocessing Uniprocessor Features MMX instructions SSE / Streaming SIMD Extensions SSE2 / Streaming SIMD Extensions 2 SSE3 / Streaming SIMD Extensions 3 SSSE3 / Supplemental Streaming SIMD Extensions 3 SSE4 / SSE4.1 + SSE4.2 / Streaming SIMD Extensions 4 EM64T / Extended Memory 64 technology / Intel 64 NX / XD / Execute disable bit VT-x / Virtualization technology Low power features Enhanced SpeedStep technology Integrated peripherals / components Integrated graphics GPU Type: HD (Haswell)

Graphics tier: GT1

Microarchitecture: Gen 7.5

Execution units: 10

Base frequency (MHz): 350

Maximum frequency (MHz): 1100

The number of supported displays: 3 Memory controller The number of controllers: 1

Memory channels: 2

Supported memory: DDR3-1333

Maximum memory bandwidth (GB/s): 21.3 Other peripherals Direct Media Interface 2.0 PCI Express 3.0 interface Electrical / Thermal parameters Thermal Design Power 53 Watt